You can't be more familiar with the universal glue. We often use it in our life, and we will think of it as long as it is an object that needs to be bonded. However, due to the low temperature in winter, the adhesive is often slow to solidify and the adhesive layer is not firmly bonded, which gives people a headache. What are the common problems and reasons for the application of universal glue?
Degumming: the coating is not completely cured. The coating is too thin. The adhesive viscosity is too high. The surface treatment is not clean, that is, too rough. The parking time is too long after the appearance treatment.
Dislocation: improper placement. The pressure is applied too early. Glue flows before heating.
Unsecure sealing: the glue strip breaks continuously during glue application. The sealant is selected incorrectly, and the gap and temperature cannot be considered. The adhesive layer is not completely cured.
Rough glue layer: the glue is mixed unevenly. The adhesive may have deteriorated or failed. It is caused by too low temperature during gluing. The time limit for correction operation is exceeded.
The adhesive layer is too brittle: the amount of curing agent is too large. The temperature is too high. Curing speed is too fast.
Loose adhesive layer: the drying time of solvent based adhesive after coating is too short. The glue is too thick at one time. The surface of the adherend has moisture. The viscosity is too high, which envelops the air, especially in winter. Insufficient pressure during curing.
Glue layer is sticky: the temperature is too low, and the glue is not completely cured. Perhaps the curing agent is not used properly or the dosage is too little. It may not work at curing time. It is possible that the drying time of solvent adhesive is short and the lamination is too early.
The above are the problems often encountered in the application of the universal glue. It is expected that the degree of application should be well controlled, including the amount of modification, the time of drying, the application environment, etc.